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BGA Reballing Systems & Services

Air-Vac Engineering
PHONE: 203.888.9900
FAX: 203.888.1145
E-MAIL: rework.sales@air-vac-eng.com
ADDRESS: Corporate Headquarters
30 Progress Avenue
Seymour, Connecticut 06483 USA
* See web page for other locations
* BGA Reballing Systems
* Rework / Repair Services & Tools
Air-Vac is committed to producing the highest quality rework/repair, selective soldering/desoldering and assembly systems designed with the capability and flexibility required to meet changing customer and industry requirements.

Beam On Technology
PHONE: 408.982.0161
FAX: 408.982.0164
E-MAIL: bot@beamon.com
ADDRESS: 2318 Calle De Luna
Santa Clara, California 95054 USA
* Solder Paste Stencil Manufacturers
* BGA Reballing Systems & Services
* Inspection Templates
* PCB Test Fixtures & Electronic / Mechanical Test / Assembly Fixtures
Beam On Technology Corporation was established in October 1992, founded by manufacturing engineers with extensive knowledge and expertise in the assembly process. Our sole purpose was to provide integrated service products to the SMT assembly industry engineered for ease of use while impacting yield, and this continues to be our goal.
Since the introduction of our first revolutionary product “Band Etch Technology™ for Stencils”, we are constantly introducing new products that respond to changes in technology. By working closely with our customers in product development, we can go the “extra mile” to meet their needs.
Our Family of Service Products include:
* Solder Paste Stencils…Our proprietary Band Etch Technology™ and laser cut stencils
* Multi Step stencils
* Our "PrintPart System" which is used to print directly on component contacts
* Rework mini stencils
* Inspection Template Overlay
* SPin Plate (Support Pin Locator Plate)
* Surface Mount Transport Plates
* Selective and Non-Selective Wave Solder Pallets
* Press Fit Fixtures
* Printed Circuit Board Stiffeners
* Metal Squeegee Blades and Blade Assemblies
* Ball Grid Array (BGA) re-ball fixtures
* Box Build Assembly Aids
* Photo Plotting

Corfin Industries LLC
CONTACT: Sales / Support
PHONE: +1.603.893.9900
FAX: +1.603.893.6800
E-MAIL: solutions@corfin.com
ADDRESS: 1050 Perimeter Road
Manchester, New Hampshire 03103 USA
* Component Harvesting
* BGA Reballing Systems & Services
* PCB Inspection / Rework Services
* Assembly Services / Contract Manufacturing / Project Management & Turnkey Services
Corfin pioneered Robotic Hot Solder Dip technology – the only process approved by the US Navy TMTI Project S1057 to eliminate the risk of tin whiskers
and weak solder joints without potential damage to the component – and with over 25 years’ experience our technicians have mastered component preparation
solutions with Corfin RHSD machinery.
Converting Pb-free components to SnPb
* Robotic Hot Solder Dip
* BGA Reballing
Component preparation services
* Lead Forming
* Reconditioning
* J-lead attach
Electronics manufacturing and support
* PCB Assembly and Rework
* Component Harvesting
* Kitting
* Testing

Process Sciences, Inc.
CONTACT: Sales / Support
PHONE: 512.259.7070
FAX: 512.259.7073
E-MAIL: Info@process-sciences.com
ADDRESS: 310 S. Brushy St.
Leander, Texas 78641 USA
* BGA Reballing Systems & Services
* Rework / Repair Services & Tools
* Electronic Testing Services
* Printed Circuit Design & Engineering Schools / PCB Technical Training / Tutorials
* Laboratory Services / Failure Analysis / Process Validation
* X-ray Inspection Services
Process Sciences, Inc. (PSI) is an SMT process engineering resource center and solutions company. Many OEMs, contract manufacturers, and hardware development teams rely on PSI for BGA reballing, circuit assembly rework and repair services, X-ray inspection, failure analysis, SMT process validation, and more. Outsourcing these services to PSI allows our clients to focus on designing and producing reliable electronics, which has made Process Sciences a sought after resource in the circuit assembly and semiconductor industry since 1994.
The SMT Master Course was designed to provide in-depth practical process understanding to those individuals interested in ensuring quality in electronic assemblies. This course was developed from a need to improve yields on the production floor. It was designed to provide practical process understanding to the individuals who produce SMT products daily. Students will leave this program with a deeper technical understanding of SMT processes, and the confidence to know how and where they fit in.
* PCB & BGA Failure Analysis, both destructive and non-destructive
* Process Validation - microsection, shear test, dye & pry, ionic cleanliness testing, tin whisker inspection, conformal coat analysis, void analysis
* Real Time, Off-axis X-Ray Inspection
* CT X-ray Analysis with 3D Volume Reconstruction
* Microsectional analysis and microscopy
* SEM/EDS (Energy Dispersive X-ray Spectroscopy) for elemental characterization and analysis
* IC Counterfeit Detection
* Ion Chromatography and C3 ionic cleanliness testing, both full board and local extraction methods
* Solderability Testing - dip and look, paste and reflow
* Surface analysis - coplanarity, roughness analysis
* AS9100D certified by Orion Registrars
* Real-time, off-axis 3D X-ray inspection of PCBA.
* Perfect for BGA X-ray inspection, QFN, LGA and other bottom terminated components.
* Five motion axes. Samples can be manipulated with a 360 degree rotational axis, and up to 75 degree oblique viewing angle, while intuitive software allows operators to visualize the most demanding defects.
* Non-destructive
* CT X-ray inspection with 3D Volume reconstruction.
* True 3D visualization and virtual cross-sections of circuit assemblies, solder joints, and components.
* Ideal for failure analysis investigations, reverse engineering, void analysis and defect visualization.
* Equipment: Two (2) Nikon X-Tek Revolution 160kV (two stations), Nikon XTV-160 160kV with CT X-ray and Xtract module, Nikon XTH225 CT X-ray station 225kV, two (2) volume reconstruction workstations with VG Studio.
* AS9100D certified by Orion Registrars

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