[Previous Page] [Next Page] [Up] [Home Page]

[Home Page]

Molded Interconnect Devices (MID)

Also see:
In Mold Electronics (IME)

Mobile Consumer Products
CONTACT: Dan Gorsage
PHONE: 847.601.6717
E-MAIL: Dan.gorsage@amphenolmcp.com
ADDRESS: 100 Tri-State International, Suite 265
Lincolnshire, Illinois 60060 USA
CATEGORIES: Molded Interconnect Devices (MID)
Amphenol Mobile Consumer Products (MCP) provides a broad range of components with presence on more than 50% of the world’s mobile devices produced each year.
Amphenol MCP designs and manufactures the full range of electro-mechanical interconnect products and antennas found in mobile phones and other mobile devices.
Our capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, is a critical factor for our success in this market.

Beta LAYOUT Ltd.
PHONE: +1.916.241.9062
E-MAIL: sales@beta-layout.us
ADDRESS: 4777 Sunrise Blvd. Suite G
95628 Fair Oaks, California USA
CATEGORIES: Molded Interconnect Devices (MID)
* Prototype Printed Circuit Board Manufacturer
* Molded Interconnect Devices (MID)
As a leading manufacturer of PCB prototypes and the successfully established 3D printing service, it was quite logical for us to bring these two technologies together.
With the help of the patented LPKF LDS (laser direct structuring) procedure we are able to generate very fine circuits on three-dimensional bodies.
By using 3D printing to form the body of the circuit carrier, and our free 3D MID design software, the opportunity to use this technology for prototypes and small series has never been better.

Harting Inc.
Of North America
CONTACT: Greg Whiteside
PHONE: 847.249.0460
E-MAIL: Greg.Whiteside@HARTING.COM
ADDRESS: 1370 Bowes Rd.
Eglin, Illinois 60123 USA
CATEGORIES: Molded Interconnect Devices (MID)
HARTING is an industrial electrical connector and electrical component manufacturer.
HARTING is the global choice connectivity solution provider for high-demand markets and critical applications.

Molex, Inc.
Antenna Business Unit
CONTACT: Colm Conlon
PHONE: 630.718.5122
E-MAIL: Colm.Conlon@molex.com
ADDRESS: 2222 Wellington Court
Lisle, Illinois 60532 USA
CATEGORIES: Molded Interconnect Devices (MID)
Molex provides extensive experience in antenna technologies from concept-to-completion. Ready-To-Use RF Antennas are compact, high performing
and available in multiple form factors for all common antenna protocols and frequencies used in IoT, automotive, industrial and medical applications.

Multiple Dimensions
North America
CONTACT: Will Slade
PHONE: 612.728.5807
E-MAIL: will.slade@multipledim.com
ADDRESS: 3136 Harriet Ave.
Minneapolis Minnesota 55408 USA
CATEGORIES: Molded Interconnect Devices (MID)
Multiple Dimensions AG is an international pacemaker for miniaturization in the technology sector.
The focus of the independent company is on 3D – MID (Molded Interconnect Devices) technology for the pioneering structure minimization of electronic devices or modules. Worldwide.

TE Connectivity
MID/Antenna Products
CONTACT: Frank Basile
PHONE: 630.718.5122
E-MAIL: fjb@tycoelectronics.com
ADDRESS: 9565 Soquel Drive
Aptos, California 95003 USA
CATEGORIES: Molded Interconnect Devices (MID)
As the go-to engineering partner for today's innovation leaders and technology entrepreneurs, we are helping solve tomorrow's toughest challenges with advanced connectivity and sensors solutions.

Web www.everythingpcb.com

[Previous]  [Next]  [Up]  [Home]